FLIR Systems, Inc. today introduced the FLIR Lepton thermal-imaging camera core. Similar in size, weight and power consumption to a conventional complementary metal-oxide semiconductor (CMOS) cell phone camera module, Lepton is one of the world’s smallest micro-bolometer-based thermal-imaging camera cores currently available. FLIR will utilise Lepton in new and existing products across many vertical markets.
The first commercial use of Lepton is in the new FLIR One thermal-imaging smart-phone accessory introduced today at 2014 International Consumer Electronics Show (CES 2014) taking place 7-10 January at the Las Vegas Convention Centre in Las Vegas, Nevada (US). Lepton has also been designed for easy integration into third-party products, such as smart phones, tablets, diagnostic tools, automobiles, toys, building controls, process equipment, security systems, machine vision systems and advanced gaming devices. Original equipment manufacturers (OEMs) around the world can benefit from the fully exportable Lepton core, which generates high-quality, fully processed thermal images through common standard interfaces.
Lepton utilises multiple proprietary technologies, including wafer-level detector packaging, wafer-level micro-optics and a custom integrated circuit (IC) that supports all camera functions on a single integrated low power chip. These and other innovations are reflected in more than 100 new patent filings worldwide related to Lepton technologies, processes and applications. The new Lepton core facilitates accurate temperature measurements and is fully compatible with FLIR’s patented Multi-Spectral Dynamic Imaging technology (MSX), which significantly enhances the thermal-image fidelity with data from a visible-light sensor.