Edmund Optics (EO), a provider of optical components, introduces new Techspec Fused Silica Wafers. These versatile wafers are thin, circular pieces of UV fused silica designed to be used as test substrates to measure the quality of optical coatings. Fused Silica Wafers are also outstanding for use as dummy components for set-up processes, as well as for semiconductor microlithography or for micro-electronic-optical applications (MEMS).
Edmund Optics' Fused Silica Wafers Exhibit less than 10Å Surface Roughness with a surface quality of 40-20. Each Fused Silica Wafer has been ultrasonically cleaned and is delivered in contaminant-free packaging to ensure highest quality.
Edmund Optics' Fused Silica Wafers are available in 100 mm, 200 mm and 300 mm diameter sizes. RoHS compliant, all have thicknesses of 1.00 mm and a transmission range of 0.2-2.2 um.