IPG Photonics Corporation, a specialist in high-power fibre lasers and amplifiers, has introduced the IX-200-F, a configurable fibre-laser micromachining workstation for general purpose, research and development (R&D) and batch-scale production applications. The multi-function system can easily be configured with different combinations of fibre lasers and beam delivery systems to address high-precision, cutting, drilling and patterning micromachining applications. It represents the combination of IPG’s fibre laser and materials micro-processing workstation technologies.
IPG’s IX-200-F is an enclosed and interlocked Center for Devices and Radiological Health (CDRH) Class 1 system, configurable with a range of IPG fibre lasers and integrated with the system operating hardware and software. The system core consists of special structural design granite to minimise the effects of vibration and thermal drift on the overall accuracy of the product. The IX-200-F features a high-resolution, high-performance microscope vision system that provides a continuous zoom range from 38X to 880X for sub-micron automated part alignment and inspection. System software includes macro-building tools for fast programming and generation of automated processes for complex feature machining. Additional utilities enable complex pattern input from standard comma-separated value (CSV) and drawing exchange format (DXF) files.
The selection of IPG fibre lasers currently supported on the IX-200-F includes pulsed infrared (IR) to more than 500 watts (W) and pulsed green up to 50W, as well as ultraviolet (UV) lasers. Users may select ablation or thermal cutting and scanning or fixed beam delivery configurations. The IX-200-F includes precision, multi-axis part-handling and vision systems for accurate machined feature placement and process control and integrated software enabling both ease-of-use and highly complex machining functions, according to the company.
Applications for IPG’s IX-200-F include cutting of ceramics, metals, polymers and semiconductor materials and patterning of indium-tin-oxide (ITO) and other thin films. Drilling applications include hole diameters down to 15 microns (µm) in 300µm thick ceramics with placement accuracies of better than 5µm at rates of 100 holes per second. The application laboratories of IPG Microsystems provide demonstrations and proof-of-concept application studies for domestic and international customers.
Figure: Top (left to right): FR-4, a composite material; ITO. Bottom (left to right): aluminium-oxide (Al2O3); copper.