Zeiss presents a new generation of focused ion beam scanning electron microscopes (FIB-SEMs) for high-end applications in research and industry. Zeiss Crossbeam 550 features a significant increase in resolution for imaging and material characterization and a speed gain in sample preparation. Nanostructures such as composites, metals, biomaterials or semiconductors can be investigated with analytical and imaging methods in parallel. Zeiss Crossbeam 550 allows simultaneous modification and monitoring of samples, resulting in fast sample preparation and high throughput, e.g., for cross-sectioning, TEM lamella preparation or nano-patterning.
According to its maker, Zeiss Crossbeam 550 provides best image quality in 2D and 3D. The new Tandem decel mode enables enhanced resolution together with a maximization of image contrast at low landing energies. The Gemini II electron optics delivers optimum resolution at low voltage and high probe current simultaneously. The FIB column combines a FIB current of 100 nA with the new FastMill mode, allowing for precise and efficient material processing and imaging in parallel. Additionally, the new process for automated emission recovery increases user-friendliness and optimizes the FIB column for reproducible results during long-term experiments.
Also new is the fully integrated module for 3D EDS analysis with Zeiss Atlas 5. With enhanced resolution at low voltages, Zeiss Crossbeam 550 is designed for life sciences and provides stability for long-term 3D tomography. Moreover, it is possible to integrate the new workstation into correlative workflows and to combine it with light, X-ray or ion beam microscopy.
Zeiss Crossbeam 550 replaces its predecessor Zeiss Crossbeam 540 and is available in a variation with a large chamber for the first time. Selected product features can be upgraded for existing Zeiss Crossbeam 540 owners.