Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced today that Bay Photonics is working on projects that require the placement and bonding of flip-chip photonics devices that require the use of specialized equipment and are using a Palomar 3880 die bonder in the process.
Bay Photonics, a UK-based company specializing in advanced photonics assembly and packaging is involved in the prototype development stage of projects requiring fine pitch of hundreds of bonding pads, some at 60-micron level. The Palomar 3880 die bonder recently purchased by the Electronic and Photonic Innovation Centre (EPIC) Paignton is being used to ensure that the final layout of the photonic ICs (PICs) is suitable for the targeted assembly and packaging processes.
Bay Photonics founded with former employees of Nortel/Bookham, Gooch & Housego, and Eltek Semiconductor have a deep understanding of the capabilities are of the various assembly methods for specific photonics applications and how to use that knowledge for building commercial prototypes that could transition to production volumes if so desired.
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