The EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has introduced the EVG50 automated metrology system.
Designed to support the increasingly stringent manufacturing requirements for advanced packaging, MEMS and photonics applications, the EVG50 performs high-resolution non-destructive multi-layer thickness and topography measurement, as well as void detection, in bonded wafer stacks and in photoresists used in optical lithography. The system measures layers down to two microns in thickness, can inspect up to one million points, and achieves throughputs of up to 55 300-mm wafers per hour. According to the company, this combination of high resolution and high throughput provides cost-efficient full-wafer inspection that enables device manufacturers to improve their wafer bonding and lithography processes, as well as achieve higher yields.
Building on a Legacy of Metrology Solutions
The standalone EVG50 system was developed based on the company's existing in-line metrology module (IMM), which is available as an option in EVG's line of 300-mm process equipment. The EVG50 complements the company’s EVG40NT measurement system for bond overlay inspection to meet increased customer demand for full-area layer thickness and topography measurement in critical applications. The EVG50's throughput, accuracy and repeatability at ultra-high resolutions, enables cost-effective, 100% inspection of production wafers, conceptualized to improve process control.
The EVG50 is designed to measure coating thickness for lithography as well as wafer bow and warpage and to make void inspections for a bonded wafer stack on the same system while its low-contact edge handling enables particle-free, full-area wafer inspection.
Leveraging a multi-sensor measurement mount, the system can be customized for different thickness ranges and substrates to address a wide variety of customer requirements. Its self-calibration capability also allows for better system reproducibility and productive uptime.
EVG will be at the SEMICON West show on 12–14 July 2016, booth #1017 in the South Hall of the Moscone Convention Center in San Francisco, California (US).
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