CEVA, a licensor of signal processing IP for smarter, connected devices, has announced a partnership with consumer electronics and appliances specialist LG Electronics to deliver a high-performance, low-cost smart 3D camera solution for consumer electronics and robotic applications.
The 3D camera module incorporates a Rockchip RK1608 coprocessor with multiple CEVA-XM4 imaging and vision DSPs, which provide the processing power to perform a wide variety of 3D sensing applications. These include biometric face authentication, 3D reconstruction, gesture/posture tracking, obstacle detection, AR and VR. Computer vision experts from CEVA, Rockchip and LG worked closely together to optimize LG's proprietary algorithms for the CEVA-XM4 using CEVA's tool kit and optimized algorithm libraries for optimal performance under stringent power constraints.
LG will be presenting and demonstrating their smart 3D module at the CEVA Technology Symposium Series in China and Taiwan, 23–27 October 2017.
CEVA’s latest generation imaging and vision DSP platforms address the extreme processing requirements and low power constraints of the most sophisticated machine learning and machine vision applications used in smartphones, surveillance, augmented reality, sense and avoid drones and self-driving cars. These DSP-based platforms include a hybrid architecture composed of scalar and vector DSP processors coupled with a comprehensive Application Development Kit (ADK) to streamline software deployment. The CEVA ADK includes: CEVA-Link for seamless software level integration with a host processor; a range of widely used and optimized software algorithms; the CEVA Deep Neural Network (CDNN2) real-time Neural Network software framework, streamlines machine learning deployment at a fraction of the power consumption of the leading GPU-based systems; and, development and debugging tools.
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