Kyocera Industrial Ceramics Corporation’s Chemical Sales Division has introduced its new environmentally friendly XKE-G5633 Epoxy Molding Compound (EMC). This room-temperature EMC offers an extended shelf-life of up to three months.
Kyocera’s new XKE-G5633 EMC is suitable for encapsulating both ball-grid array (BGA) and land-grid array (LGA) semiconductor packages, offering the same high-quality encapsulation and connectivity as similar compounds that must be stored in a frozen state. Kyocera’s product, however, is stored at room temperature and is ready for immediate use, providing customers with more flexibility in production planning and eliminating the downtime caused by traditional EMC thawing.
With its shelf-life of three months at room temperature, Kyocera’s XKE-G5633 helps customers prevent material losses due to the significantly shorter shelf-life of typical EMC products. Kyocera’s XKE-G5633 product is now available in both sample and bulk delivery options.
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