Teledyne DALSA, a Teledyne Technologies company and specialist in machine vision technology, announces the availability of its newest charge-domain CMOS TDI camera – the Linea HS 16k Multifield TDI camera. Multifield imaging allows end-users to capture multiple images e.g. brightfield, darkfield, and backlit images simultaneously in a single scan.
Based on a multi-array TDI sensor architecture, the 16k camera offers 100-kHz x 3 line rate or 5 GPix/sec data throughput for high-performance imaging applications such as flat panel display, PCB and wafer inspection, life science, aerial imaging and web inspection.
A first in the industry, the Linea HS 16k Multifield camera uses integrated dichroic filters with minimum spectral crosstalk to spectrally isolate and capture up to three field images e.g. brightfield, darkfield and backlit in a single scan. Combined with advanced lighting, multifield significantly improves tact time and detectability.
Combined with Teledyne’s Xtium 2 CLHS series of high-performance frame grabbers, these new products represent a breakthrough in data throughput. Built on field-proven technology, the next generation CLHS fiber optic interface provides reliable and high throughput data transmission. Fiber optic cables lower system costs, offer longer cable lengths (up to 300 m), are immune to electromagnetic radiation, and are ideal for industrial environments. Teledyne DALSA’s Xtium2 family of high-performance frame grabbers feature the PCI Express Gen 3 x8 platform.
- High speed of up to 100k-Hz x 3 line rate in 16k resolutions, or 5 Gpix/sec
- Minimum spectral crosstalk
- Very low noise and high sensitivity
- Active pixel assisted alignment
- Camera Link HS fiber optic interface for high reliability and long cable data transmission
- Lowers system costs