Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company and global leader in machine vision technology, is pleased to announce the release of its newest charge-domain CMOS TDI camera – the Linea HS 32k TDI camera using patent-pending pixel offset technology.
The Linea HS 32k uses two 16k/5μm TDI arrays with pixel offset. Two 16k/5μm images are captured in real time, then reconstructed to achieve a higher resolution image of 32k/2.5μm. This upconversion significantly enhances detectability for subpixel defects. One advantage of the patent-pending pixel offset technology is that existing lighting and 16k/5μm lenses can be used without sacrifice in responsivity and MTF with a smaller physical pixel size.
Combined with Teledyne’s Xtium2 CLHS series of high-performance frame grabbers, these new products represent a breakthrough in data throughput. Built on field-proven technology, the next generation CLHS fiber optic interface provides reliable and high throughput data transmission. Fiber optic cables lower system costs, offer longer cable lengths (up to 300 m), are immune to electromagnetic radiation in industrial environments. Teledyne DALSA’s Xtium2 family of high-performance frame grabbers feature the PCI Express Gen 3.0 x8 platform.
- Up to 150 kHz line rate in 32k/2.5um resolutions, or 5 Gpix/sec
- Compatible with existing lighting and lenses for 16k/5μm
- Very low noise and high sensitivity
- Active pixel assisted alignment
- Camera Link HS fiber optic interface for high reliability and long cable data transmission
- Lowers system costs