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Characterization of Chemical Mechanical Wafer Polishing Processes

The Nano Surfaces Division of Bruker has introduced the TriboLab CMP Process and Material Characterization System, which provides a unique characterization capability for the development of chemical mechanical polishing (CMP) processes on the UMT TriboLab mechanical testing platform. The new TriboLab CMP system is the only tool on the market that can provide a broad range of polishing pressure (0.05–50 psi), speeds (1 to 500 rpm), friction, acoustic emissions and surface temperature measurements for the characterization of CMP processes and consumables.

Labels: chemical mechanical polishing,Bruker,TriboLab CMP Process and Material Characterization System,UMT TriboLab,TriboLab CMP

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