The development of ever smaller components and integrated circuits requires the deployment of more innovative methods of high-speed Automated Optical Inspection (AOI) systems. One such area is the inspection of unpopulated and populated printed circuit boards (PCBs) where the correct assembly and connection of nearly all mounted electronic components -- BGAs, SMDs, IC chips, resistors, capacitors and LEDs -- are checked.
The Chromasens 3DPIXA stereoscopic color line scan camera can be used for this purpose. It combines 2D and 3D visualizations in one camera to achieve new levels of detail in critical inspections including PCB solder quality. Designed for simple integration into new and existing AOI systems, the 3DPIXA marks a huge step forward from conventional mechanical or electrical inspection processes.
The Chromasens 3DPIXA has an optical resolution of 5 μm for two-dimensional color visualizations and 1 μm for three-dimensional image capture at line scan frequencies up to 60 kHz. This extremely high resolution is the basic requirement for the inspection of wire bonds having a thickness of less than 1 mil (1/1000 inch = 0.0254 millimeters). The color visualization supports troubleshooting by means of fast recognition of production errors and the color reproduction of the assembled components. A flexible 3D-API (Application Programming Interface) offers users convenient control of all camera functions.
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