The Lasers & Material Processing division of Jenoptik is selling its thermal laser separation technology to 3D-Micromac AG.
The transfer enables the company based in Chemnitz, Germany, to broaden its portfolio of laser systems in the field of semiconductor technology and also to directly market this laser technology. In the future, Jenoptik’s Lasers & Material Processing division will continue to focus on the 3D processing of plastics and metals, such as those used in the automotive industry.
With TLS-Dicing, brittle materials can be separated ensuring high quality, preventing the loss of material, and working at high speeds, the company reports. For example, the process is applied in the separation of components made of semiconductor wafers. The material is heated up locally by laser and then cooled down quickly by means of a cooling water jet. That causes high tensions in the material, forming a defined facture along the course of the laser beam.
In contrast to customary separating technologies, TLS-Dicing is characterized by clean edges without microcracks and, consequentially, by higher bending strength. Process speeds of 200 up to 300 mm/s are possible and normally result in the multiplication of the output while costs are reduced.
3D-Micromac AG specialises in laser micromachining systems as well as coating and printing technologies.
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