Compound Photonics US Corporation (CP), a provider of compact high-resolution microdisplay solutions for Augmented Reality (AR) and Mixed Reality (MR) applications, and Plessey Semiconductors Ltd. (Plessey), an embedded technologies developer at the forefront of microLED technology for AR and MR display applications, today announced a strategic partnership to develop and introduce the World’s smallest 1080p (1920x1080 pixel) GaN-on-Silicon microLED based microdisplay solution suitable for integration into AR and MR smart glasses.
Under this partnership, Plessey will bond CP’s industry leading high speed digital low-latency backplane silicon wafer with Plessey’s breakthrough cutting edge proprietary GaN on Silicon monolithic microLED array wafer. In turn, CP will utilize its deep experience in microdisplay assembly, test, and packaging to create display modules from the bonded wafers in combination with CP’s NOVA high-performance display driver architecture to deliver a complete solution compatible with the industry standard MIPI display pipeline.
Initial samples of a 0.26 inch diagonal, full HD 1080p resolution microLED display integrated with display driver IC to accept industry standard MIPI input are expected to be available by mid-year 2020.
Compound Photonics is a pioneer in compact high resolution microdisplay technologies. Our microdisplay solutions are optimized to serve the augmented reality and mixed reality markets where high performance, small form factor, and low power consumption are most critical. Compound Photonics’ microdisplays enable engineers to innovate and create cutting edge consumer and industrial products that can greatly enhance the lives of people.
Plessey is an award-winning provider of full-field emissive microLED displays that combine very high-density RGB pixel arrays with high-performance CMOS backplanes to produce very high-brightness, low-power and high-frame-rate image sources for head-mounted displays (HMDs), and augmented reality (AR) and virtual reality (VR) systems. Plessey operates leading edge 150mm and 200mm wafer processing facilities to undertake design, test and assembly of LED products, and a comprehensive suite of photonic characterization and applications laboratories.