Palomar Technologies, a specialist in delivering total process solutions for advanced photonics and microelectronic device packaging, announced today they are offering a webinar that presents the key factors to achieving successful void-free die attach using a vacuum reflow system.
There are many factors to consider when it comes to achieving desirable die attach and lid seal bonding; one of the most important of these factors is solder interface voiding. Voids in the solder interface contribute to various failure modes including overheating via non-uniform dissipation of heat and high mechanical stresses. Vacuum reflow systems offer solutions to achieve low solder interface voiding through chamber pressure manipulations and surface treatment options. In addition, the correct solder material selection is key in achieving excellent bond quality. Each application is unique and requires careful consideration when it comes to solder material selection.
In this free webinar proper material, solder, and process/tooling selection will be explored to provide a successful void-free die attach using a vacuum reflow system. In addition, several case studies will be presented to demonstrate how proper selections make a difference.
The webinar takes place on April 13 at 8 am PST. Register here.
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